Invention Grant
- Patent Title: Light-emitting dies incorporating wavelength-conversion materials and related methods
- Patent Title (中): 掺有波长转换材料的发光管和相关方法
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Application No.: US14624096Application Date: 2015-02-17
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Publication No.: US09276178B2Publication Date: 2016-03-01
- Inventor: Michael A. Tischler
- Applicant: Michael A. Tischler
- Applicant Address: CA Richmond
- Assignee: Cooledge Lighting, Inc.
- Current Assignee: Cooledge Lighting, Inc.
- Current Assignee Address: CA Richmond
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/50 ; H01L27/14 ; H05B33/12 ; H01L25/075 ; H01L33/48 ; H01L23/00 ; H01L33/10 ; H05B33/02 ; H01L29/00 ; H01L33/00 ; H01L27/15 ; H01L31/0232 ; H01L31/0203 ; H01L31/0224 ; H01L31/048 ; H01L31/055 ; H01L33/54 ; H01L33/58 ; H01L33/62 ; H01L33/44 ; H01L25/00 ; H01L33/60
Abstract:
In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
Public/Granted literature
- US20150162504A1 LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS Public/Granted day:2015-06-11
Information query
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