Invention Grant
- Patent Title: Methods of treating a semiconductor layer
- Patent Title (中): 处理半导体层的方法
-
Application No.: US13601110Application Date: 2012-08-31
-
Publication No.: US09276157B2Publication Date: 2016-03-01
- Inventor: Donald Franklin Foust , Hongbo Cao , Laura Anne Clark , Robert Andrew Garber , Scott Daniel Feldman-Peabody , Wyatt Keith Metzger , Yinghui Shan , Roman Shuba
- Applicant: Donald Franklin Foust , Hongbo Cao , Laura Anne Clark , Robert Andrew Garber , Scott Daniel Feldman-Peabody , Wyatt Keith Metzger , Yinghui Shan , Roman Shuba
- Applicant Address: US AZ Tempe
- Assignee: First Solar, Inc.
- Current Assignee: First Solar, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: MacMillan, Sobanski & Todd, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/073 ; H01L21/02 ; H01L31/0224 ; H01L31/0392

Abstract:
Methods for treating a semiconductor layer including a semiconductor material are presented. A method includes contacting at least a portion of the semiconductor material with a passivating agent. The method further includes forming a first region in the semiconductor layer by introducing a dopant into the semiconductor material; and forming a chalcogen-rich region. The method further includes forming a second region in the semiconductor layer, the second region including a dopant, wherein an average atomic concentration of the dopant in the second region is greater than an average atomic concentration of the dopant in the first region. Photovoltaic devices are also presented.
Public/Granted literature
- US20140065763A1 METHODS OF TREATING A SEMICONDUCTOR LAYER Public/Granted day:2014-03-06
Information query
IPC分类: