The present invention provides a dynamic quantity device which reduces stress received by a sensor due to resin packaging and reduces variation in sensor characteristics due to stress. The dynamic quantity sensor includes a semiconductor substrate including a fixing part and a flexible part and a movable part positioned on an interior side of the fixing part, and a cap component configured to cover the flexible part and the movable part, wherein the fixing part includes an interior frame configured to enclose the flexible part and the movable part and an exterior part positioned on a periphery of the interior frame, a slit configured to divide the interior frame and the exterior frame, and a linking part configured to link the interior frame and the exterior frame.