Invention Grant
- Patent Title: Semiconductor device having buried gate electrode structures
- Patent Title (中): 具有掩埋栅电极结构的半导体器件
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Application No.: US14613438Application Date: 2015-02-04
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Publication No.: US09276107B2Publication Date: 2016-03-01
- Inventor: Marko Lemke , Rolf Weis , Stefan Tegen
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/94 ; H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L21/8234 ; H01L29/06

Abstract:
A semiconductor device includes first and second gate electrode structures and a connection plug. The first gate electrode structure is buried in a semiconductor portion and has array stripes inside a first cell array of transistor cells and a contact stripe outside the first cell array, the contact stripe structurally connected with the array stripes. The second gate electrode structure is buried in the semiconductor portion and has array stripes inside a second cell array of transistor cells. An array isolation region of the semiconductor portion separates the first and second gate electrode structures. The connection plug extends between a first surface of the semiconductor portion and the contact stripe of the first gate electrode structure.
Public/Granted literature
- US20150145029A1 SEMICONDUCTOR DEVICE HAVING BURIED GATE ELECTRODE STRUCTURES Public/Granted day:2015-05-28
Information query
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