Invention Grant
- Patent Title: Silicon carbide semiconductor device
- Patent Title (中): 碳化硅半导体器件
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Application No.: US14430141Application Date: 2013-09-04
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Publication No.: US09276105B2Publication Date: 2016-03-01
- Inventor: Shunsuke Yamada , Toru Hiyoshi , Takeyoshi Masuda , Keiji Wada
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori
- Priority: JP2012-232604 20121022
- International Application: PCT/JP2013/073783 WO 20130904
- International Announcement: WO2014/065015 WO 20140501
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/16

Abstract:
A silicon carbide semiconductor device includes an element region and a guard ring region. A semiconductor element is provided in the element region. The guard ring region surrounds the element region in a plan view and has a first conductivity type. The semiconductor element includes a drift region having a second conductivity type different from the first conductivity type. The guard ring region includes a linear region and a curvature region continuously connected to the linear region. A value obtained by dividing a radius of curvature of an inner circumference portion of the curvature region by a thickness of the drift region is not less than 5 and not more than 10. Accordingly, there can be provided a silicon carbide semiconductor device capable of improving a breakdown voltage while suppressing decrease of on-state current.
Public/Granted literature
- US20150214353A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2015-07-30
Information query
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