Invention Grant
- Patent Title: Semiconductor device having a gate recess structure
- Patent Title (中): 具有栅极凹部结构的半导体器件
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Application No.: US13294740Application Date: 2011-11-11
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Publication No.: US09276100B2Publication Date: 2016-03-01
- Inventor: Hiroshi Endo , Toshihiro Ohki , Toshihide Kikkawa
- Applicant: Hiroshi Endo , Toshihiro Ohki , Toshihide Kikkawa
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2010-276379 20101210
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/778 ; H01L29/423 ; H01L29/66 ; H01L29/20

Abstract:
A semiconductor device includes a first semiconductor layer disposed over a substrate, a second semiconductor layer disposed over the first semiconductor layer, a gate recess disposed, through removal of a part of or all the second semiconductor layer, in a predetermined region over the first semiconductor layer, an insulating film disposed over the gate recess and the second semiconductor layer, a gate electrode disposed over the gate recess with the insulating film therebetween, and a source electrode and a drain electrode disposed over the first semiconductor layer or the second semiconductor layer, whereby a central portion of the gate recess is higher than a peripheral portion of the gate recess.
Public/Granted literature
- US20120146097A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-06-14
Information query
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