A focal plane array (FPA) comprising a photodiode array (PDA) and a read out integrated circuit (ROIC), wherein the FPA can include a plurality of conductive bumps that electrically couple PDA circuitry to ROIC circuitry. In an embodiment, an optically transparent lid can include a plurality traces electrically coupled to circuitry on the ROIC which can be used as a conductive path between the ROIC and external pads.