Invention Grant
US09275992B1 Formation of electrical components on a semiconductor substrate by polishing to isolate the components 有权
通过抛光在半导体衬底上形成电气部件以隔离部件

Formation of electrical components on a semiconductor substrate by polishing to isolate the components
Abstract:
Trenches may be formed in layers on a semiconductor substrate for defining electrical components for an electronic device, such as an amplifier. A polishing step may be performed after formation of the trenches and deposition of other layer(s) to define regions for resistors, capacitors, or other elements in a metal layer on a semiconductor substrate. The polishing step may create discontinuities in metal layers on the semiconductor substrate that define electrically isolated regions corresponding to the resistors, capacitor, and other components of the electronic device.
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