Invention Grant
US09275968B2 Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same
有权
具有芯片固定结构的倒装芯片封装，包括该芯片固定结构的电子系统和包括该固定结构的存储卡
- Patent Title: Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same
- Patent Title (中): 具有芯片固定结构的倒装芯片封装，包括该芯片固定结构的电子系统和包括该固定结构的存储卡
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Application No.: US14516223Application Date: 2014-10-16
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Publication No.: US09275968B2Publication Date: 2016-03-01
- Inventor: Jung Tae Jeong , Si Eon Kim , Jong Woo Ahn
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon
- Priority: KR10-2014-0063832 20140527
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A flip chip package includes a chip having a surface, main bumps disposed on a first region of the surface of the chip, dummy bumps disposed on a second region of the surface of the chip, a substrate having a surface, dams disposed on the surface of the substrate, connection pads disposed on the surface of the substrate and electrically connected to respective ones of the main bumps, and adhesion patterns attaching the dummy bumps to respective ones of the dams.
Public/Granted literature
Information query
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