Invention Grant
- Patent Title: Low cost high frequency device package and methods
-
Application No.: US13485573Application Date: 2012-05-31
-
Publication No.: US09275961B2Publication Date: 2016-03-01
- Inventor: Eric A. Sanjuan , Sean S. Cahill
- Applicant: Eric A. Sanjuan , Sean S. Cahill
- Applicant Address: DE Fridolfing
- Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Current Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Current Assignee Address: DE Fridolfing
- Agency: DeLio, Peterson & Curcio LLP
- Agent Robert Curcio
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L23/66 ; H01L23/047 ; H01L23/00 ; H05K1/02
Abstract:
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
Public/Granted literature
- US20120234588A1 LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS Public/Granted day:2012-09-20
Information query
