Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US14371021Application Date: 2012-05-01
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Publication No.: US09275928B2Publication Date: 2016-03-01
- Inventor: Akihiro Matsusue
- Applicant: Akihiro Matsusue
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- International Application: PCT/JP2012/061536 WO 20120501
- International Announcement: WO2013/164876 WO 20131107
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L21/00 ; H01L23/373 ; H01S5/022 ; H01S5/024 ; H01L31/024 ; H01S5/062 ; H01S5/183
Abstract:
A metallic ring is located on a multilayer ceramic substrate. An optical semiconductor laser is located on the multilayer ceramic substrate, inside the metallic ring. A metallic cap with a window is joined to the metallic ring. The metallic cap covers the optical semiconductor laser. An external heat sink is joined to an external side surface of the metallic cap. These features make it possible to improve high-frequency characteristics, producibility, and heat dissipation.
Public/Granted literature
- US20140328361A1 SEMICONDUCTOR PACKAGE Public/Granted day:2014-11-06
Information query
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