Invention Grant
- Patent Title: Temporary substrate, transfer method and production method
- Patent Title (中): 临时底物，转移方法和生产方法
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Application No.: US13174363Application Date: 2011-06-30
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Publication No.: US09275888B2Publication Date: 2016-03-01
- Inventor: Gregory Riou
- Applicant: Gregory Riou
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1055767 20100715
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46 ; H01L21/683
Abstract:
Temporary substrates may include a bonding surface prepared for receiving an additional substrate that will transfer a thin layer. Such substrates may include a principal part or support and a surface layer thereon with the surface layer having a plurality of inserts therein. The inserts are made of a material having a coefficient of thermal expansion that is significantly different from that of the material constituting the surface layer. Processing methods for transferring a selected portion of an original substrate may involve such temporary substrates and productions methods may produce such temporary substrates.
Public/Granted literature
- US20120015498A1 TEMPORARY SUBSTRATE, TRANSFER METHOD AND PRODUCTION METHOD Public/Granted day:2012-01-19
Information query
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