Systems and methods for preventing warpage of a semiconductor substrate in a semiconductor package. A continuous or uninterrupted stiffener structure is designed with a recessed groove, such that passive components, such as, high density capacitors are housed within the recessed groove. The stiffener structure with the recessed groove is attached to the semiconductor substrate using anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). The stiffener structure with the recessed groove surrounds one or more semiconductor devices that may be formed on the semiconductor substrate. The stiffener structure with the recessed groove does not extend beyond horizontal boundaries of the semiconductor substrate.