Invention Grant
- Patent Title: Multilayered power inductor and method for preparing the same
- Patent Title (中): 多层功率电感器及其制备方法
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Application No.: US14078231Application Date: 2013-11-12
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Publication No.: US09275785B2Publication Date: 2016-03-01
- Inventor: Sung Sik Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0128155 20121113
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/255 ; H01F27/28 ; H01F1/33 ; H01F1/26

Abstract:
Disclosed herein are a multilayered power inductor including an inner electrode coil pattern formed on a ceramic substrate; an outer electrode layer; and a magnetic layer made of a metal powder insulated along a grain interface of the metal powder included in a part or the whole of a chip, and a method for preparing the same. According to the exemplary embodiments of the present invention, the magnetic layer made of the metal powder insulation-coated with the ceramic material along the grain interface of the magnetic metal powder can be used for a part or the whole of the chip, thereby increasing the filling ratio of the magnetic metal powder to 90% within the magnetic layer. Therefore, a high-capacity power inductor can be implemented to effectively improve efficiency characteristics.
Public/Granted literature
- US20140132387A1 MULTILAYERED POWER INDUCTOR AND METHOD FOR PREPARING THE SAME Public/Granted day:2014-05-15
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