A wearable tag capable of wireless communications includes a first elastic layer, a second elastic layer over the first elastic layer, wherein the second elastic layer is embedded with a first conductive circuit. The wearable tag includes a dielectric layer on the second elastic layer, a third elastic layer on the dielectric layer, wherein the third elastic layer is embedded with a second conductive circuit, wherein the dielectric layer comprises via holes that contain electric connections between the semiconductor chip and the first conductive circuit. A semiconductor chip is in connection with the first conductive circuit and the second conductive circuit, wherein the semiconductor chip, the first conductive circuit, and the second conductive circuit are configured to wirelessly communicate with external devices. The wearable tag also includes a fourth elastic layer on the semiconductor chip.