Invention Grant
- Patent Title: System and method for thermally aware device booting
- Patent Title (中): 用于热感知设备启动的系统和方法
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Application No.: US13420139Application Date: 2012-03-14
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Publication No.: US09274805B2Publication Date: 2016-03-01
- Inventor: Jon J. Anderson , Ron F. Alton , Praveen Kumar Chidambaram , Joshua D. Thielen
- Applicant: Jon J. Anderson , Ron F. Alton , Praveen Kumar Chidambaram , Joshua D. Thielen
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nicolas A. Cole
- Main IPC: G06F9/00
- IPC: G06F9/00 ; G06F9/44

Abstract:
Various embodiments of methods and systems for thermally aware booting in a portable computing device (“PCD”) are disclosed. Because bringing high power consumption processing components online when a PCD is booted under less than ideal thermal conditions can be detrimental to the health of the PCD, embodiments leverage a low power processing component early in a boot sequence to authorize, delay or modify the boot sequence based on measured thermal indicators. One exemplary method is essentially a “go/no go” method that delays or authorizes completion of a boot sequence based on the thermal indicator measurements. Another exemplary method modifies a boot sequence of a PCD based on a thermal boot policy associated with a thermal boot state. A thermal boot policy may include allowing the boot sequence to complete by modifying the power frequency to which one or more high power consumption components will be booted.
Public/Granted literature
- US20130227261A1 System and Method For Thermally Aware Device Booting Public/Granted day:2013-08-29
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