Invention Grant
- Patent Title: Infrared sensor and heat sensing element
- Patent Title (中): 红外传感器和热敏元件
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Application No.: US14223683Application Date: 2014-03-24
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Publication No.: US09274004B2Publication Date: 2016-03-01
- Inventor: Takayuki Yonemura , Takafumi Noda , Yasushi Tsuchiya , Yasuaki Hamada
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2013-062266 20130325
- Main IPC: G01J5/00
- IPC: G01J5/00 ; G01J5/10 ; G01J5/04 ; G01J5/34
Abstract:
An infrared sensor includes a heat sensing element, the heat sensing element includes a first electrode, a second electrode and a dielectric film formed between the first electrode and the second electrode. The heat sensing element senses heat based on a change of a resistance value. The dielectric film includes at least Bi and Fe.
Public/Granted literature
- US20140284480A1 INFRARED SENSOR AND HEAT SENSING ELEMENT Public/Granted day:2014-09-25
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