Invention Grant
US09272370B2 Laser ablating structures for antenna modules for dual interface smartcards
有权
用于双接口智能卡的天线模块的激光烧蚀结构
- Patent Title: Laser ablating structures for antenna modules for dual interface smartcards
- Patent Title (中): 用于双接口智能卡的天线模块的激光烧蚀结构
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Application No.: US14281876Application Date: 2014-05-19
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Publication No.: US09272370B2Publication Date: 2016-03-01
- Inventor: David Finn , Mustafa Lotya
- Applicant: David Finn , Mustafa Lotya
- Applicant Address: IE Lower Churchfield, Tourmakeady, Co. Mayo
- Assignee: Féinics AmaTech Teoranta
- Current Assignee: Féinics AmaTech Teoranta
- Current Assignee Address: IE Lower Churchfield, Tourmakeady, Co. Mayo
- Agent Gerald E. Linden
- Main IPC: B23K26/364
- IPC: B23K26/364 ; B23K26/36 ; H01Q1/22 ; H01Q7/00 ; B23K26/40 ; H01Q1/38 ; H01Q7/06 ; G06K19/077
Abstract:
Laser etching antenna structures (AS) for RFID antenna modules (AM). Combining laser etching and chemical etching. Limiting the thickness of the contact pads (CP) to less than the skin depth (18 m) of the conductive material (copper) used for the contact pads (CP). Multiple antenna structures (AS1, AS2) in an antenna module (AM). Incorporating LEDs into the antenna module (AM) or smartcard (SC).
Public/Granted literature
- US20140284386A1 LASER ABLATING STRUCTURES FOR ANTENNA MODULES FOR DUAL INTERFACE SMARTCARDS Public/Granted day:2014-09-25
Information query
IPC分类:
