Invention Grant
- Patent Title: Headphone
- Patent Title (中): 耳机
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Application No.: US14438767Application Date: 2012-10-26
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Publication No.: US09253558B2Publication Date: 2016-02-02
- Inventor: Shunming Yuen
- Applicant: INNOVATION SOUND TECHNOLOGY CO., LTD.
- Applicant Address: US CA Guangdong
- Assignee: INNOVATION SOUND TECHNOLOGY CO., LTD.
- Current Assignee: INNOVATION SOUND TECHNOLOGY CO., LTD.
- Current Assignee Address: US CA Guangdong
- Agency: Fitch, Even, Tabin and Flannery LLP
- International Application: PCT/CN2012/083568 WO 20121026
- International Announcement: WO2014/063345 WO 20140501
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
The utility model provides a headphone, comprising a headband, left and right two ear pads and a holder. Two ends of the headband are separately provided with a fixing component, the fixing component includes a conductor block; the holder is made of the conductive material, of which one end is respectively connected with the left and right two ear pads fixedly and the other end is respectively connected with the fixing components in a sliding way, and the conductor block is pressed against the holder; in the ear pads, the first group of signal wires is connected to the holder electrically; in the fixing components, the second group of signal wires is connected with the conductor block electrically. The headphone provided in the utility model replaces the exposed lead with the conductive holder which is used as the medium for the audio signal transfer between the left and right two ear pads, thus eliminating the exposed lead on the headphone, simplifying the structure and avoiding the risk of broken circuit due to the damage of the exposed lead in use previously.
Public/Granted literature
- US20150256918A1 HEADPHONE Public/Granted day:2015-09-10
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