Invention Grant
- Patent Title: High frequency high isolation multichip module hybrid package
- Patent Title (中): 高频高隔离多芯片模块混合封装
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Application No.: US13772874Application Date: 2013-02-21
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Publication No.: US09252734B2Publication Date: 2016-02-02
- Inventor: Tamir Moran , Gregory S. Gonzales
- Applicant: NATIONAL INSTRUMENTS CORPORATION
- Applicant Address: US TX Austin
- Assignee: National Instruments Corporation
- Current Assignee: National Instruments Corporation
- Current Assignee Address: US TX Austin
- Agency: Meyertons Hood Kivlin Kowert & Goetzel, P.C.
- Agent Jeffrey C. Hood
- Main IPC: H03H5/02
- IPC: H03H5/02 ; H01R13/7197 ; H01L23/66 ; H01L25/16
Abstract:
In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.
Public/Granted literature
- US20140078683A1 High Frequency High Isolation Multichip Module Hybrid Package Public/Granted day:2014-03-20
Information query
