Invention Grant
- Patent Title: Acoustic wave device and method for manufacturing the same
- Patent Title (中): 声波装置及其制造方法
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Application No.: US13367836Application Date: 2012-02-07
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Publication No.: US09252732B2Publication Date: 2016-02-02
- Inventor: Takashi Yamashita
- Applicant: Takashi Yamashita
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2011-026534 20110209
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H01L41/22 ; H03H9/64 ; H01L41/047 ; H03H3/08 ; H03H9/02

Abstract:
An acoustic wave device includes: a piezoelectric substrate; a dielectric layer formed on the piezoelectric substrate; and first and second comb-tooth electrodes formed on the dielectric layer, the dielectric layer having a first thickness between the first comb-tooth electrodes and the piezoelectric substrate and a second thickness between the second comb-tooth electrodes and the piezoelectric substrate, the first and second thicknesses being different from each other.
Public/Granted literature
- US20120200371A1 ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-08-09
Information query
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