Invention Grant
US09252548B1 High density networking component for 1U product form factor and associated rack system 有权
高密度网络组件,用于1U产品外形和相关机架系统

High density networking component for 1U product form factor and associated rack system
Abstract:
Systems and apparatuses are disclosed having a 3×8 stacked RJ45 connector with an integrated LEDs option for a 1U product form factor to provide increased density of an RJ45 connector which utilizes open source and non-proprietary modular connectors in conformity with published standards. For example, in one embodiment such systems and apparatuses include a networking component having therein a connector which includes a plurality of RJ45 jacks arranged into exactly three horizontal rows and a plurality of vertical columns; a printed circuit board to electrically interface with each of the plurality of RJ45 jacks; and a 1× Rack Unit (1U) chassis having the connector and printed circuit board therein, in which at least a portion of the connector extends into a horizontal plane occupied by the printed circuit board. Rack systems and methods are further described for employing such a networking component.
Information query
Patent Agency Ranking
0/0