Invention Grant
US09252548B1 High density networking component for 1U product form factor and associated rack system
有权
高密度网络组件,用于1U产品外形和相关机架系统
- Patent Title: High density networking component for 1U product form factor and associated rack system
- Patent Title (中): 高密度网络组件,用于1U产品外形和相关机架系统
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Application No.: US14325373Application Date: 2014-07-08
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Publication No.: US09252548B1Publication Date: 2016-02-02
- Inventor: Alice Meng , Unnikrishnan Gangadharan , Marwan Naboulsi , Gavin Richard Cato
- Applicant: Extreme Networks, Inc.
- Applicant Address: US CA San Jose
- Assignee: Extreme Networks, Inc.
- Current Assignee: Extreme Networks, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Blakely, Sokoloff, Taylor & Zafman
- Main IPC: H01R13/60
- IPC: H01R13/60 ; H01R24/64

Abstract:
Systems and apparatuses are disclosed having a 3×8 stacked RJ45 connector with an integrated LEDs option for a 1U product form factor to provide increased density of an RJ45 connector which utilizes open source and non-proprietary modular connectors in conformity with published standards. For example, in one embodiment such systems and apparatuses include a networking component having therein a connector which includes a plurality of RJ45 jacks arranged into exactly three horizontal rows and a plurality of vertical columns; a printed circuit board to electrically interface with each of the plurality of RJ45 jacks; and a 1× Rack Unit (1U) chassis having the connector and printed circuit board therein, in which at least a portion of the connector extends into a horizontal plane occupied by the printed circuit board. Rack systems and methods are further described for employing such a networking component.
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