Invention Grant
- Patent Title: Power connector having enhanced thermal conduction characteristics
- Patent Title (中): 电源连接器具有增强的热传导特性
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Application No.: US14162975Application Date: 2014-01-24
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Publication No.: US09252512B2Publication Date: 2016-02-02
- Inventor: Pal Debabrata
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Scott D. Wofsy; Joshua L. Jones
- Main IPC: H01R13/00
- IPC: H01R13/00 ; H01R12/70 ; H01R12/58
Abstract:
A power connector assembly is disclosed that includes a connector shell formed from a heat conducting material, a plurality of connector pins arranged in the connector shell, and a heat conduction element arranged in the connector shell in thermal contact with the plurality of connector pins for conducting heat dissipated by the connector pins to the connector shell.
Public/Granted literature
- US20150050830A1 POWER CONNECTOR HAVING ENHANCED THERMAL CONDUCTION CHARACTERISTICS Public/Granted day:2015-02-19
Information query
