Invention Grant
- Patent Title: Circuit module including a splitter and a mounting substrate
- Patent Title (中): 电路模块包括分路器和安装基板
-
Application No.: US14057000Application Date: 2013-10-18
-
Publication No.: US09252476B2Publication Date: 2016-02-02
- Inventor: Syuichi Onodera
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-095193 20110421
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H01P5/12 ; H03H9/05 ; H05K1/02 ; H05K1/11

Abstract:
In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode flows into via conductors that are connected along an edge portion of the ground electrode close to the transmission electrode and connected to a ground line of a motherboard. Therefore, the transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along an edge portion of the ground electrode toward a reception electrode side. Thus, characteristics of isolation between the transmission electrode and the reception electrode provided on the mounting substrate on which the splitter is mounted are improved.
Public/Granted literature
- US20140045546A1 CIRCUIT MODULE Public/Granted day:2014-02-13
Information query