Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
- Patent Title (中): 半导体器件及其制造方法相同
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Application No.: US14112097Application Date: 2012-02-24
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Publication No.: US09252261B2Publication Date: 2016-02-02
- Inventor: Shigeharu Yamagami , Tetsuya Hayashi , Taku Shimomura
- Applicant: Shigeharu Yamagami , Tetsuya Hayashi , Taku Shimomura
- Applicant Address: JP Yokohama-shi
- Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee Address: JP Yokohama-shi
- Agency: Foley & Lardner LLP
- Priority: JP2011-092962 20110419
- International Application: PCT/JP2012/054622 WO 20120224
- International Announcement: WO2012/144271 WO 20121026
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/417 ; H01L27/06 ; H01L29/66 ; H01L29/165 ; H01L29/06 ; H01L29/423 ; H01L29/16

Abstract:
An anode region 106 is formed on a bottom portion of a trench 105 in which a gate electrode 108 is formed or in a drift region 102 immediately under the trench 105. A contact hole 110 is formed in the trench 105 at a depth reaching the anode region 106. A source electrode 112 is embedded in the contact hole 110 while interposing an inner wall insulating film 111 therebetween. The anode region 106 and the source electrode 112 are electrically connected to each other in a state of being insulated from the gate electrode 108 by the inner wall insulating film 111.
Public/Granted literature
- US20140042523A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2014-02-13
Information query
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