Invention Grant
- Patent Title: Power semiconductor device
- Patent Title (中): 功率半导体器件
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Application No.: US14243873Application Date: 2014-04-02
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Publication No.: US09252212B2Publication Date: 2016-02-02
- Inventor: Jae Hoon Park , Ji Hye Kim , Kyu Hyun Mo , Dong Soo Seo , In Hyuk Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0000244 20140102
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/739 ; H01L29/10

Abstract:
A power semiconductor device may include: an active region in which a current flows through a channel formed when the device being turned on; a termination region disposed around the active region; a first semiconductor region of a first conductive type disposed in the termination region in a direction from the active region to the termination region; and a second semiconductor region of a second conductive type disposed in the termination region in the direction from the active region to the termination region, the first semiconductor region and the second semiconductor region being disposed alternately.
Public/Granted literature
- US20150187868A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2015-07-02
Information query
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