Invention Grant
- Patent Title: Solid-state imaging device and manufacturing method of the same, and imaging unit
- Patent Title (中): 固态成像装置及其制造方法及成像单元
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Application No.: US13604155Application Date: 2012-09-05
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Publication No.: US09252173B2Publication Date: 2016-02-02
- Inventor: Yoshiaki Kitano
- Applicant: Yoshiaki Kitano
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2011-222743 20111007
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148
Abstract:
A solid-state imaging device includes a light sensing unit generating a signal charge by performing a photoelectric conversion of an incident light; a conductive material in the vicinity of the light sensing unit; a first light-shielding film formed to cover at least a portion of the conductive material; and a second light-shielding film formed on a part of or all of a surface of the first light-shielding film.
Public/Granted literature
- US20130088713A1 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME, AND IMAGING UNIT Public/Granted day:2013-04-11
Information query
IPC分类:
