Invention Grant
- Patent Title: Semiconductor substrate and semiconductor chip
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Application No.: US14474384Application Date: 2014-09-02
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Publication No.: US09252137B2Publication Date: 2016-02-02
- Inventor: Takayuki Hashimoto
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2010-62141 20100318
- Main IPC: H01L29/861
- IPC: H01L29/861 ; H01L25/16 ; H01L23/495 ; H01L25/07 ; H01L29/739 ; H01L27/06 ; H01L23/00

Abstract:
A semiconductor substrate capable of detecting operating current of a MOSFET and diode current in a miniaturized MOSFET such as a trench-gate type MOSFET is provided. A semiconductor substrate includes a main current region and a current sensing region in which current smaller than main current flowing in the main current region flows. The main current region has a source electrode disposed on a main surface, the source electrode being in contact with a p-type semiconductor region (body) and an n+-type semiconductor region (source), and the current sensing region has a MOSFET current detecting electrode and a diode current detecting electrode on a main surface, the MOSFET current detecting electrode being in contact with the p-type semiconductor region (body) and the n+-type semiconductor region (source), the diode current detecting electrode being in contact with the p-type semiconductor region (body).
Public/Granted literature
- US20140367685A1 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR CHIP Public/Granted day:2014-12-18
Information query
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