Invention Grant
US09252135B2 Packaged semiconductor devices and methods of packaging semiconductor devices
有权
封装的半导体器件和封装半导体器件的方法
- Patent Title: Packaged semiconductor devices and methods of packaging semiconductor devices
- Patent Title (中): 封装的半导体器件和封装半导体器件的方法
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Application No.: US14180208Application Date: 2014-02-13
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Publication No.: US09252135B2Publication Date: 2016-02-02
- Inventor: Chen-Hua Yu , Chung-Shi Liu , Chih-Fan Huang , Chih-Wei Lin , Wei-Hung Lin , Ming-Da Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/10 ; H01L21/56 ; H01L23/31 ; H01L23/528 ; H01L21/768 ; H01L21/82 ; H01L23/04 ; H01L23/367 ; H01L23/00
Abstract:
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.
Public/Granted literature
- US20150228632A1 Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices Public/Granted day:2015-08-13
Information query
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