Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US13602257Application Date: 2012-09-03
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Publication No.: US09252129B2Publication Date: 2016-02-02
- Inventor: Tae Sik Yun , Sang Jin Byeon
- Applicant: Tae Sik Yun , Sang Jin Byeon
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0025391 20120313
- Main IPC: H03K19/00
- IPC: H03K19/00 ; H01L25/065 ; H03K19/003 ; G01R31/28

Abstract:
A semiconductor apparatus includes: a slave chip including a signal transfer unit configured to determine whether or not to transfer an input signal in response to a chip select signal; a master chip including a replica circuit unit having the same configuration as the signal transfer unit and a signal output unit configured to receive an output signal of the signal transfer unit and an output signal of the replica circuit unit and generate an output signal in response to the control signal; a first through-chip via vertically formed through the slave chip, and having one end connected to the master chip to receive the input signal and the other end connected to the signal transfer unit; and a second through-chip via vertically formed through the slave chip, and having one end connected to the signal transfer unit and the other end connected to the signal output unit.
Public/Granted literature
- US20130241314A1 SEMICONDUCTOR APPARATUS Public/Granted day:2013-09-19
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