Invention Grant
- Patent Title: Panelized backside processing for thin semiconductors
- Patent Title (中): 薄半导体的面板化背面处理
-
Application No.: US13282712Application Date: 2011-10-27
-
Publication No.: US09252128B2Publication Date: 2016-02-02
- Inventor: Arvind Chandrasekaran
- Applicant: Arvind Chandrasekaran
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Donald D. Min
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L25/065 ; H01L21/768
Abstract:
A semiconductor manufacturing method includes attaching a first die to a substrate panel. The method also includes applying a mold compound after attaching the first die to the substrate panel to the first die and the substrate panel. The method further includes thinning the first die and the mold compound after applying the mold compound. Attaching the die to the substrate panel before thinning eliminates usage of a carrier wafer when processing thin semiconductors.
Public/Granted literature
- US20120040497A1 PANELIZED BACKSIDE PROCESSING FOR THIN SEMICONDUCTORS Public/Granted day:2012-02-16
Information query
IPC分类:
