Invention Grant
- Patent Title: Multi Chip Package-type semiconductor device
- Patent Title (中): 多芯片封装型半导体器件
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Application No.: US13796903Application Date: 2013-03-12
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Publication No.: US09252126B2Publication Date: 2016-02-02
- Inventor: Atsushi Tomohiro
- Applicant: PS4 Luxco S.a.r.l.
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.a.r.l.
- Current Assignee: PS4 Luxco S.a.r.l.
- Current Assignee Address: LU Luxembourg
- Priority: JP2012-083953 20120402
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L25/00 ; H01L23/00 ; H01L25/065 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor device includes a wiring board, a first semiconductor chip mounted on the wiring board via a first adhesive member, and second semiconductor chip stacked on the first semiconductor chip via a second adhesive member. The first adhesive member is a die attach film having an adhesive layer formed on both surfaces of an insulating base, and the second adhesive member is an adhesive paste.
Public/Granted literature
- US20130256918A1 DEVICE Public/Granted day:2013-10-03
Information query
IPC分类:
