Invention Grant
US09252072B2 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
有权
组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法
- Patent Title: Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
- Patent Title (中): 组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法
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Application No.: US14096729Application Date: 2013-12-04
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Publication No.: US09252072B2Publication Date: 2016-02-02
- Inventor: Kerry Bernstein , Thomas Brunschwiler , Bruno Michel
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent Vazken Alexanian
- Main IPC: H01L23/46
- IPC: H01L23/46 ; H01L23/473 ; H01L25/065 ; H01L23/498
Abstract:
An assembly includes a chip including an integrated circuit, a casing including an integrated circuit including plural active elements and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
Public/Granted literature
Information query
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