Invention Grant
- Patent Title: Multilayer type inductor and method of manufacturing the same
- Patent Title (中): 多层型电感器及其制造方法
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Application No.: US13620676Application Date: 2012-09-14
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Publication No.: US09251943B2Publication Date: 2016-02-02
- Inventor: Dong Jin Jeong , Hyeog Soo Shin , Jae Wook Lee
- Applicant: Dong Jin Jeong , Hyeog Soo Shin , Jae Wook Lee
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0114898 20111107
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/24 ; H01F17/00 ; H01F27/29 ; H01F41/04

Abstract:
There is provided a multilayer type inductor, including: an inductor main body; a coil part having conductive circuits and conductive vias formed in the inductor main body; and external electrodes formed on both ends of the inductor main body, wherein in the inductor main body, at least parts around the conductive circuits and the conductive vias are formed of a ferrite material or a non-magnetic material.
Public/Granted literature
- US20130113593A1 MULTILAYER TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-05-09
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