Invention Grant
- Patent Title: Components with microchannel cooling
- Patent Title (中): 具有微通道冷却的组件
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Application No.: US13326540Application Date: 2011-12-15
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Publication No.: US09249670B2Publication Date: 2016-02-02
- Inventor: Ronald Scott Bunker
- Applicant: Ronald Scott Bunker
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Ann M. Agosti
- Main IPC: F01D5/18
- IPC: F01D5/18 ; F01D5/20 ; F01D5/28

Abstract:
A component includes a substrate having an outer surface, an inner surface and a tip. The inner surface defines at least one hollow, interior space. The outer surface defines one or more grooves, where each groove extends at least partially along the outer surface of the substrate and has a base. The component further includes a coating disposed over at least a portion of the outer surface of the substrate. The coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels for cooling the component. The tip comprises a tip cap enclosing the hollow, interior space(s), and a tip rim disposed at a radially outer end of the substrate. The tip rim at least partially defines at least one discharge channel in fluid communication with at least one cooling channel.
Public/Granted literature
- US20130156600A1 COMPONENTS WITH MICROCHANNEL COOLING Public/Granted day:2013-06-20
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