Invention Grant
- Patent Title: Method for regenerating plating solution
- Patent Title (中): 电镀液再生方法
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Application No.: US14759699Application Date: 2013-02-05
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Publication No.: US09249511B2Publication Date: 2016-02-02
- Inventor: Nobuhiro Kanazawa , Katsuhiro Goto , Tatsuya Banno
- Applicant: FUJI SHOJI CO., LTD.
- Applicant Address: JP Hashima-shi
- Assignee: FUJI SHOJI CO., LTD.
- Current Assignee: FUJI SHOJI CO., LTD.
- Current Assignee Address: JP Hashima-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/052606 WO 20130205
- International Announcement: WO2014/122726 WO 20140814
- Main IPC: C23C18/31
- IPC: C23C18/31 ; C23C18/32 ; C23C18/38 ; C23C18/54 ; C25D21/16 ; C25D21/18 ; C02F1/54 ; C02F1/64 ; C02F1/72 ; C02F1/78 ; C23C18/16 ; C02F1/52 ; C02F101/20 ; C02F103/16

Abstract:
The problem addressed by the present invention is to provide a method for facilitating the regenerating a waste plating solution as a plating solution. This method for regenerating an acidic waste plating solution containing, as ions, Fe and at least one plating metal element selected from the group consisting of Cu, Ni, Zn, Co, and Mn by removing Fe therefrom is characterized in having an addition step in which phytic acid is added to the waste plating solution to yield a phytic-acid-containing solution in which Fe ions are precipitated, and a removal step in which the precipitate is removed from the phytic-acid-containing solution to yield a regenerated plating solution.
Public/Granted literature
- US20150345024A1 METHOD FOR REGENERATING PLATING SOLUTION Public/Granted day:2015-12-03
Information query
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