Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
-
Application No.: US14632128Application Date: 2015-02-26
-
Publication No.: US09248652B2Publication Date: 2016-02-02
- Inventor: Shunsuke Watanabe
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2014-040876 20140303
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/14

Abstract:
A liquid ejecting apparatus is provided with a liquid ejecting head that ejects a liquid from nozzle openings and a wiping section that sweeps over a liquid ejecting surface side of the liquid ejecting head, the liquid ejecting head is provided with a nozzle plate that has the liquid ejecting surface and a protective member which has an opening section, and which is provided to protrude further on a side of liquid discharge than the nozzle plate and which exposes the liquid ejecting surface, the wiping section sweeps over the liquid ejecting surface of the nozzle plate by moving toward a sweeping direction, which is an in-plane direction of the liquid ejecting surface, and, in the nozzle plate, a distance in an orthogonal direction, which is orthogonal to the sweeping direction, of a first blank space section from an end of the nozzle plate to an end nozzle opening that is provided on a side of the end is longer than a distance in the sweeping direction of a second blank space section from an end of the nozzle plate to an end nozzle opening that is provided on a side of the end.
Public/Granted literature
- US20150246544A1 LIQUID EJECTING APPARATUS Public/Granted day:2015-09-03
Information query
IPC分类: