Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head
- Patent Title (中): 液体喷射头，液体喷射装置和液体喷射头的制造方法
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Application No.: US14227756Application Date: 2014-03-27
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Publication No.: US09248649B2Publication Date: 2016-02-02
- Inventor: Hajime Nakao , Shunsuke Watanabe
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Maschoff Brennan
- Priority: JP2013-071280 20130329
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14 ; B41J2/16
Abstract:
Provided is a liquid ejecting head which ejects liquid from nozzle holes by changing a pressure in a liquid flow path in a pressure chamber. The liquid ejecting head includes a flow path member which is formed of ceramic, and in which the pressure chamber is formed; and a piezoelectric element which includes at least a first piezoelectric layer which is formed of ceramic. The first piezoelectric layer of the piezoelectric element is bonded to the flow path member, and the first piezoelectric layer faces the pressure chamber.
Public/Granted literature
- US20140292945A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND METHOD OF MANUFACTURING LIQUID EJECTING HEAD Public/Granted day:2014-10-02
Information query
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