Invention Grant
- Patent Title: Build platform leveling and homing
- Patent Title (中): 构建平台调平和归位
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Application No.: US14288893Application Date: 2014-05-28
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Publication No.: US09248600B2Publication Date: 2016-02-02
- Inventor: Taylor S. Goodman , Mark Waller , Aljosa Kemperle
- Applicant: MakerBot Industries, LLC
- Applicant Address: US NY Brooklyn
- Assignee: MakerBot Industries, LLC
- Current Assignee: MakerBot Industries, LLC
- Current Assignee Address: US NY Brooklyn
- Agency: Strategic Patents, P.C.
- Main IPC: B28B1/14
- IPC: B28B1/14 ; B29C47/08 ; B29C67/00 ; B29L9/00

Abstract:
A three-dimensional printer uses its extruder and build platform to properly orient the build platform within a working volume. In a multi-point leveling operation, the extruder is moved to the z-axis origin at a number of x-y positions within the plane of the build platform, and the height of the build platform is adjusted to meet the extruder at the origin. If the build platform is a meltable material such as a plastic, then this leveling process must be performed while the extruder is cool. A homing operation may be performed periodically after leveling in order to realign the z-axis positions of the build platform and extruder. A non-meltable contact point may be usefully provided so that homing can be performed while the extruder is hot, such as immediately before a build or between a number of builds.
Public/Granted literature
- US20150343688A1 BUILD PLATFORM LEVELING AND HOMING Public/Granted day:2015-12-03
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