Invention Grant
- Patent Title: Method of detecting abnormality in polishing of a substrate and polishing apparatus
- Patent Title (中): 检测基板和研磨装置的抛光异常的方法
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Application No.: US14034488Application Date: 2013-09-23
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Publication No.: US09248543B2Publication Date: 2016-02-02
- Inventor: Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2012-209499 20120924
- Main IPC: B24B37/005
- IPC: B24B37/005 ; B24B9/06
Abstract:
A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
Public/Granted literature
- US20140087627A1 METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POLISHING APPARATUS Public/Granted day:2014-03-27
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