Invention Grant
- Patent Title: Cable gland assembly
- Patent Title (中): 电缆接头总成
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Application No.: US14153774Application Date: 2014-01-13
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Publication No.: US09231397B2Publication Date: 2016-01-05
- Inventor: Teh-Tsung Chiu
- Applicant: AVC INDUSTRIAL CORP.
- Applicant Address: TW New Taipei
- Assignee: AVC INDUSTRIAL CORP.
- Current Assignee: AVC INDUSTRIAL CORP.
- Current Assignee Address: TW New Taipei
- Agency: Sinorica, LLC
- Agent Ming Chow
- Main IPC: H02G15/02
- IPC: H02G15/02 ; H02G15/013 ; F16J15/02 ; H02G15/184

Abstract:
A cable gland assembly includes a mounting member mounted in a predetermined object, one or multiple connection members, an outer cap, and one first packing device and one or multiple second packing devices mounted in the mounting member between the connection members and the outer cap and compressible by the outer cap and the connection members to wrap about the periphery of an inserted cable and to provide multiple packing effects. Thus, the cable gland assembly has high IP rating, and is practical for dynamic mechanical application, or application in a deep-water environment or high explosive atmosphere.
Public/Granted literature
- US20150200531A1 CABLE GLAND ASSEMBLY Public/Granted day:2015-07-16
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