Invention Grant
US09155199B2 Passive device embedded in substrate and substrate with passive device embedded therein
有权
被动设备嵌入基板和基板中,其中嵌有无源器件
- Patent Title: Passive device embedded in substrate and substrate with passive device embedded therein
- Patent Title (中): 被动设备嵌入基板和基板中,其中嵌有无源器件
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Application No.: US14041235Application Date: 2013-09-30
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Publication No.: US09155199B2Publication Date: 2015-10-06
- Inventor: Yee Na Shin , Yul Kyo Chung , Seung Eun Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0108952 20120928
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01G4/228 ; H05K3/46

Abstract:
The present invention relates to a passive device embedded in a substrate, which includes a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers; a first external electrode covering one side surface of the laminate and having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and is smaller than the first upper cover region; and a second external electrode covering the other side surface of the laminate and having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and is smaller than the second lower cover region, and the substrate.
Public/Granted literature
- US20140090881A1 PASSIVE DEVICE EMBEDDED IN SUBSTRATE AND SUBSTRATE WITH PASSIVE DEVICE EMBEDDED THEREIN Public/Granted day:2014-04-03
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