- Patent Title: Semiconductor device with selectively etched surface passivation
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Application No.: US14601804Application Date: 2015-01-21
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Publication No.: US09153448B2Publication Date: 2015-10-06
- Inventor: Bruce M. Green , Darrell G. Hill , Jenn Hwa Huang , Karen E. Moore
- Applicant: Bruce M. Green , Darrell G. Hill , Jenn Hwa Huang , Karen E. Moore
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Lempia Summerfield Katz LLC
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L21/311 ; H01L29/40 ; H01L29/66 ; H01L29/778 ; H01L29/06 ; H01L29/10 ; H01L29/812 ; H01L29/20

Abstract:
A semiconductor device includes a semiconductor substrate configured to include a channel, a gate supported by the semiconductor substrate to control current flow through the channel, a first dielectric layer supported by the semiconductor substrate and including an opening in which the gate is disposed, and a second dielectric layer disposed between the first dielectric layer and a surface of the semiconductor substrate in a first area over the channel. The second dielectric layer is patterned such that the first dielectric layer is disposed on the surface of the semiconductor substrate in a second area over the channel.
Public/Granted literature
- US20150132932A1 SEMICONDUCTOR DEVICE WITH SELECTIVELY ETCHED SURFACE PASSIVATION Public/Granted day:2015-05-14
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