A shield structure for an electronic apparatus includes a frame member and a shield box. The frame member is a conductive frame to which the wiring substrate is attached and covering a back surface of the wiring substrate. The shield box is formed on a front surface of the wiring substrate having an electronic component mounted thereon, to cover an area of a portion of the front surface. The wiring substrate includes a plurality of connecting portions formed thereon that ground the front surface and the back surface to the frame member. On a side on which the wiring substrate protrudes from the shield box, the shield box includes a shield wall member forming a wall surface substantially perpendicular to the wiring substrate. The shield wall member is grounded to at least one location of the connecting portions of the wiring substrate in the vicinity of the wall surface.