Invention Grant
- Patent Title: Metal foil having electrical resistance layer, and manufacturing method for same
- Patent Title (中): 具有电阻层的金属箔及其制造方法
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Application No.: US14008254Application Date: 2012-03-27
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Publication No.: US09099229B2Publication Date: 2015-08-04
- Inventor: Toshio Kurosawa
- Applicant: Toshio Kurosawa
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: JP2011-070760 20110328
- International Application: PCT/JP2012/057979 WO 20120327
- International Announcement: WO2012/133439 WO 20121004
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C7/00 ; C23C14/02 ; C23C14/16 ; B32B15/01 ; C22C19/05 ; H05K1/16 ; C22C1/02 ; H05K1/09 ; H05K3/02

Abstract:
The present invention provides a metal foil provided with an electrical resistance layer, in which peeling between the metal foil and the electrical resistance layer disposed on the metal foil can be prevented and variation in the resistivity of the resistance layer can be reduced, and a method of manufacturing the same. The present invention includes a metal foil with an electrical resistance layer including a metal foil having a surface of a ten-point mean roughness Rz, which is measured by an optical method according to 1 μm or less and the surface being treated by irradiation with ion beams at an ion beam intensity of 0.70-2.10 sec·W/cm2 and an electrical resistance layer disposed on the surface of the metal foil.
Public/Granted literature
- US20140015635A1 METAL FOIL HAVING ELECTRICAL RESISTANCE LAYER, AND MANUFACTURING METHOD FOR SAME Public/Granted day:2014-01-16
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