Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
-
Application No.: US14055778Application Date: 2013-10-16
-
Publication No.: US09097958B2Publication Date: 2015-08-04
- Inventor: Jang Hun Kim , Hwan Jun Kang , Sang Jin Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2013-0091942 20130802
- Main IPC: G03B17/02
- IPC: G03B17/02

Abstract:
There is provided a camera module including: a housing including a lens barrel disposed therein; a first shield can coupled to the housing so that a lower end portion of an outer surface of the housing is exposed; a circuit board mounted at the lower end portion of the housing; and a second shield can covering the first shield can and the lower end portion of the housing, wherein the second shield can is provided with protrusion parts pressing an outer surface of the first shield can.
Public/Granted literature
- US20150037025A1 CAMERA MODULE Public/Granted day:2015-02-05
Information query