Invention Grant
US09097637B2 Integrated electronic device for monitoring parameters within a solid structure and monitoring system using such a device
有权
集成电子设备,用于监测实体结构中的参数和使用这种设备的监控系统
- Patent Title: Integrated electronic device for monitoring parameters within a solid structure and monitoring system using such a device
- Patent Title (中): 集成电子设备,用于监测实体结构中的参数和使用这种设备的监控系统
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Application No.: US13996259Application Date: 2011-10-20
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Publication No.: US09097637B2Publication Date: 2015-08-04
- Inventor: Alberto Pagani , Bruno Murari
- Applicant: Alberto Pagani , Bruno Murari
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: ITMI2010A2365 20101222
- International Application: PCT/EP2011/068359 WO 20111020
- International Announcement: WO2012/084295 WO 20120628
- Main IPC: G01N27/00
- IPC: G01N27/00 ; G01M5/00 ; G01L1/26

Abstract:
An electronic device is for detecting and monitoring a local parameter within a solid structure. The electronic device may include an integrated detection module having a functional IC including an integrated sensor to detect the local parameter within the solid structure, and an antenna and having a functional circuitry surface facing towards an outside of the functional IC, and a passivation layer to cover at least the functional circuitry surface of the functional IC so that the functional IC is hermetically sealed and galvanically insulated from a surrounding environment. The electronic device may also include an RF circuit to be coupled with the integrated detection module and having a remote antenna configured to transmit/receive signals for telecommunications and energy exchange with the antenna. The antenna, the RF circuit, and the remote antenna may wirelessly communicate via an electromagnetic coupling.
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