Invention Grant
- Patent Title: Component mounting method and component mounting apparatus
- Patent Title (中): 部件安装方法和部件安装装置
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Application No.: US13203841Application Date: 2010-12-28
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Publication No.: US09078385B2Publication Date: 2015-07-07
- Inventor: Kazuo Kido , Kenichi Kaida
- Applicant: Kazuo Kido , Kenichi Kaida
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-009436 20100119
- International Application: PCT/JP2010/007585 WO 20101228
- International Announcement: WO2011/089681 WO 20110728
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B23P19/00 ; H05K13/00

Abstract:
A component mounting method of mounting a component onto a board by a component mounting apparatus which includes a transportation device having a plurality of rails capable of transporting a plurality of boards in parallel is provided. The method includes positioning the rails so that a center of a mounting area in a forward-backward direction is at an intermediate position between corresponding parts of two component supply units, the mounting area covering an area in which two mounting heads mount components on one or more of the boards which are transported by the transportation device, and the intermediate position being equally distant in the forward-backward direction from the two component supply units; and alternately mounting the components in the mounting area between the two mounting heads.
Public/Granted literature
- US20110308081A1 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS Public/Granted day:2011-12-22
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