An apparatus and associated methodology associated with a thermally conductive frame having a perimeter surface defining a passage. A printed circuit board assembly (PCBA) is operably disposed within the passage and connected to the frame. The PCBA includes a solid state memory component. An internal cover is disposed in the passage on one side of the PCBA. The internal cover conducts heat to the frame that is operably generated by the solid state memory component. An external cover is attachable to the frame on an opposing side of the PCBA. The external cover cooperates with the frame and the internal cover to enclose the PCBA.