Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US13692704Application Date: 2012-12-03
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Publication No.: US09077881B2Publication Date: 2015-07-07
- Inventor: Jae Hoon Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0127739 20111201
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B3/04 ; G02B21/36

Abstract:
Disclosed herein is a camera module herein. The camera module includes a case; a bracket that is installed in the case, wherein an elastic element is interposed between the bracket and the case, and the bracket is elastically supported in the case by the elastic element; a substrate coupled to a lower portion of the bracket; an image sensor installed on the printed circuit board, wherein an upper portion of the image sensor is inserted into the bracket; and a focusing and tilt adjuster that is coupled through a bottom surface of the case, wherein a front end portion of the focusing and tilt adjuster contacts the substrate.
Public/Granted literature
- US20130162894A1 CAMERA MODULE Public/Granted day:2013-06-27
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